Material Supply
YURAY TECH delivers substrates prepared for your next process.
OVERVIEW
From material selection and custom sizing to thinning and surface planarization, we help reduce handling steps, shorten process handoffs, and provide substrates aligned with advanced packaging and R&D requirements.
SERVICES
Silicon Wafer Substrate
Glass Substrate
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.