X-Ray
X-ray inspection delivers non-destructive thickness measurement, void detection, material composition analysis, and internal defect detection for semiconductor substrates and packages. This technique provides clear imaging of hidden defects, enabling accurate quality verification and failure analysis without damaging samples.
Application Scenarios: Void inspection, composition analysis, defect detection.
Classic Standard: ASTM E505 / IPC-A-610.
Charging Standard: 1,000 RMB per hour.
OVERVIEW
YURAY provides comprehensive X-ray inspection services for non-destructive internal quality analysis of semiconductor packages, solder joints, TSV structures, BGA / flip-chip assemblies, and advanced packaging components. Our high-resolution X-ray system delivers sub-micron feature detection with excellent contrast sensitivity — enabling void detection, solder-joint inspection, wire-bond analysis, and internal structural verification without damaging the sample. We support 2D radiography and oblique-angle inspection for comprehensive quality assessment.
SERVICES
Our X-ray inspection platform enables non-destructive internal quality evaluation across a wide range of package types and device structures — supporting failure analysis, incoming quality inspection, and production process monitoring.
Solder Joint & BGA Inspection
High-resolution X-ray inspection of BGA, CSP, and flip-chip solder joints for void detection, bridging, open circuits, and misalignment — enabling non-destructive solder quality assessment and process optimization.
| Parameter | Specification |
|---|---|
| Resolution | ≤ 1 μm feature detection |
| Void Detection | ≥ 2% void ratio |
| Package Types | BGA, CSP, QFN, flip-chip |
| Voltage Range | 20 – 160 kV |
| Inspection Modes | 2D / Oblique-angle |
| Sample Size | Up to 200 mm |
| Analysis Output | Void ratio, size, distribution |
TSV & Internal Structure Analysis
X-ray inspection of through-silicon vias (TSV), copper pillars, and internal package structures for void detection, fill quality, and dimensional verification — supporting 3D IC integration and advanced packaging development.
| Parameter | Specification |
|---|---|
| TSV Diameter | ≥ 5 μm detectable |
| Void Detection in TSV | ≥ 3% void ratio |
| Structure Types | TSV, Cu pillar, RDL, bump |
| Voltage Range | 30 – 130 kV |
| Imaging Modes | 2D radiography |
| Sample Size | Up to 12-inch wafer |
| Quantitative Analysis | Void % + size distribution |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven X-ray inspection results.
BGA Solder Void Inspection & Analysis
- 2D X-ray at optimized kV setting
- Sample Supply — BGA package samples (5 units), incoming inspection and sample registration
- Automated void detection and measurement
- Analysis — Statistical analysis of void diameters
- Analysis — Classification by void type and location
- Metrology — X-ray images for each sample
- 5 samples received & logged
- 100% ball coverage achieved
- Average void ratio: 12%
- Void size distribution chart delivered
- Defect classification report delivered
- All images included in report
- Images, data, and analysis consolidated
- Final inspection report delivered
TSV Copper Fill X-Ray Quality Analysis
- High-resolution X-ray at optimized parameters
- Sample Supply — 8-inch TSV wafer (Cu-filled, 10×50 μm), incoming inspection and die selection
- Image analysis for void percentage
- Analysis — Multi-site sampling across wafer
- Analysis — Qualitative grading of TSV fill
- Metrology — Optional SEM cross-section verification
- 8-inch wafer supported
- Voids detected in 8% of TSVs
- Void ratio: 3–15% range
- Center-edge distribution mapped
- Quality grades: A / B / C assigned
- X-ray findings confirmed by SEM
- X-ray images, void data, and analysis integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.