INSIGHTS · NEWS
News & Insights
Technical updates, industry perspectives and project highlights from the YURAY TECH team.
NEWS
October-Fri-2026
Advancing TGV Glass Interposers for Next-Gen High-Bandwidth Packaging
Through-glass via (TGV) technology is emerging as a key enabler for high-frequen...
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NEWS
October-Fri-2026
YURAY Partners with Leading Research Institute on 2.5D Interposer R&D
YURAY TECH is pleased to announce a joint development program focused on fine-pi...
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NEWS
October-Fri-2026
Glass Substrates for mmWave 5G/6G Front-End Modules
Glass-core substrates offer superior RF performance vs. organic laminates at mmW...
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NEWS
October-Fri-2026
Co-Packaged Optics (CPO): The Next Frontier in Data Center Interconnects
As switch bandwidths scale to 51.2T and beyond, co-packaged optics (CPO) is movi...
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NEWS
October-Fri-2026
YURAY TECH Expands Metrology Lab with New AFM and SEM Capabilities
YURAY TECH has upgraded its in-house metrology laboratory with newly installed a...
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NEWS
October-Fri-2026
Why 3D IC Stacking Matters for AI Accelerator Roadmaps
AI training clusters demand more memory bandwidth every generation. Large langua...
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