Applications Powered
by YURAY
Enabling innovation across semiconductor, photonics, sensing, and emerging high-performance applications
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Microfabrication &
Advanced Packaging
YURAY provides end-to-end OEM support—from material selection and preparation to process development, characterization, and performance testing.
Dicing
Mechanical & laser dicing
Bonding
Hybrid & anodic wafer bonding
Wafer Thinning
Back-grinding & CMP planarization
Electroplating
Cu pillar, bump & RDL plating
Etching
DRIE, ICP, RIE & metal etching
Photolithography
Contact aligner, stepper & step-and-scan
Film Deposition
PVD, CVD, ALD & thermal evaporation
AOI
Automated optical inspection
Warpage Measurement
Wafer bow & flatness metrology
Laser Scanning Confocal Microscope
3D confocal surface profiling
FIB
Focused ion beam cross-sectioning
TEM
Transmission electron microscopy
SEM
Scanning electron microscopy
Ellipsometer
Film thickness & optical constants
CT
Computed tomography 3D imaging
X-Ray
X-ray imaging & inspection
AFM
Atomic force surface topography
Precision Probe Testing / Precision Probe Measurement
Fine-pitch probe measurement
Kelvin Resistance Measurement
Low-resistance contact measurement
Peel Testing / Peel Strength Testing
Adhesion & peel strength
Tensile Testing / Pull Testing
Bond & joint strength measurement
High-Temperature Testing
Thermal stability & endurance
Salt Spray Testing / Salt Fog Testing
Corrosion resistance verification
Technology Roadmap
Building a progressive capability path in advanced packaging — from proven interconnect processes to next-generation glass-based and optical integration solutions.
Foundation: Flip-Chip & TSV Interposer Fabrication
Building core capabilities in Flip-chip assembly and TSV interposer manufacturing to support high-density micro-connects and 2.5D/3D advanced packaging solutions.
Expansion: TGV Technology Development
Developing through-glass via technologies, including glass via formation, metallization, and interposer integration, to enable low-loss, high-frequency, and high-performance packaging platforms.
Application: TGV Applications & CPO Integration
Extending TGV-based interposer applications across high-speed, RF, and interposer integration markets, while advancing Co-Packaged Optics (CPO) solutions for next-generation data connectivity and computing systems.
Why YURAY
More than a fabrication partner—we help transform complex technical challenges into practical, scalable solutions
End-to-End Process Chain
From substrate sourcing through deposition, lithography, etching, bonding, bumping, and full characterization — one integrated workflow, no handoffs.
R&D & Small-Batch Focus
We support research institutions, confidential R&D teams, and startups — flexible single-step services with technical support and testing reports.
Closed-Loop Quality Delivery
Every batch includes detailed test reports — SEM, AFM, X-ray, ellipsometer, thermal/mechanical/electrical characterization — before shipment.
Process Precision Guaranteed
DRIE aspect ratio up to 30:1, TSV vias as small as 3µm, CMP Ra under 1nm — qualified with SEM/CT inspection and reliability testing.
Trsusted Partners
We support research institutions, confidential R&D teams, and startups with flexible process services, technical support, characterization, and reporting.
About YURAY TECH
YURAY TECH is a technology-driven partner specializing in microfabrication, advanced interconnects, and semiconductor packaging.
We combine process expertise, flexible engineering support, and end-to-end manufacturing capabilities to help innovators move from concept to validated solutions
Tailored Solutions
Across the Value Chain
SOW Quantification
We meticulously analyze your Statement of Work to quantify exact project requirements and deliverables.
Process Confirmation
Our engineering team defines and validates the optimal fabrication processes for your specific needs.
Material Provision
We source and provide premium grade materials required to ensure the highest manufacturing quality.
Process Execution
Expert technicians execute precise micro and nano fabrication techniques in our state-of-the-art facility.
Characterization
We utilize advanced metrology tools to conduct rigorous physical and structural characterization of wafers.
Testing & Reporting
Comprehensive testing and detailed reporting ensure all final deliverables perfectly align with your original SOW.
Advancing TGV Glass Interposers for Next-Gen High-Bandwidth Packaging
YURAY Partners with Leading Research Institute on 2.5D Interposer R&D
Glass Substrates for mmWave 5G/6G Front-End Modules
Co-Packaged Optics (CPO): The Next Frontier in Data Center Interconnects
YURAY TECH Expands Metrology Lab with New AFM and SEM Capabilities
Why 3D IC Stacking Matters for AI Accelerator Roadmaps
Start Your OEM Project
with YURAY
Whether you need material evaluation, process development, prototype fabrication, characterization, or performance testing, our team is ready to discuss your requirements.