Glass Substrate
Fused silica, borosilicate glass and engineered thin-glass substrates — from MEMS and microfluidics to high-performance TGV interposers and photonic packaging.
OVERVIEW
SERVICES
Fused Silica
High-purity synthetic fused silica with exceptional UV transmission, ultra-low coefficient of thermal expansion, and high laser damage resistance — ideal for high-precision optics and photonic applications.
| Parameter | Specification |
|---|---|
| Material Grade | JSG1 / JSG2 / JSG3 |
| SiO₂ Purity | > 99.995% |
| Transmission Range | 185 nm – 2.5 μm |
| Coefficient of Thermal Expansion | 0.55 × 10⁻⁶ /°C |
| Dielectric Constant | 3.8 @ 1 MHz |
| Thickness | 0.15 – 3.0 mm |
| Surface Roughness | < 0.3 nm Ra |
Glass
Borosilicate and ultra-thin engineered glass substrates with excellent thermal stability, low dielectric loss, and tunable CTE — optimized for TGV, advanced packaging, and display applications.
| Parameter | Specification |
|---|---|
| Glass Types | Borofloat 33 / EXG / AF32 |
| Coefficient of Thermal Expansion | 3.2 – 3.8 × 10⁻⁶ /°C |
| Dielectric Constant | 4.1 – 4.6 @ 1 MHz |
| Thickness | 100 μm – 3 mm |
| Thickness Uniformity | ±10% per sheet |
| Surface Roughness | < 0.5 nm Ra |
| Wafer / Panel Size | 4" – 12" / 515×510 mm |
CASE STUDY
At YURAY, we provide precision glass substrate supply tailored to your specific application requirements — from fused silica for optics to borosilicate glass for TGV and advanced packaging.
Fused Silica Wafer for Optics
BF33 Glass Panel for TGV
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.