About YURAY TECH
YURAY TECH LIMITED — Global semiconductor supply partner for advanced packaging and micro-nano fabrication.
Who We Are
We are a collaborative nanofabrication platform and equipment provider, delivering advanced process capabilities and professional solutions to research and industrial customers. We empower innovation in advanced semiconductor packaging through end-to-end process services and expert reports, supported by uncompromising quality, technical expertise, and reliable supply chains.
What We Do
Our vertically integrated service model covers the full wafer-processing chain — from substrate sourcing and dimensional customization to advanced thin-film deposition, photolithography, etching, wafer bonding, bumping, RDL processing, and laser marking. Comprehensive process characterization, metrology, and testing ensure consistent quality, culminating in professional reports and verified final-product delivery.
Who We Serve
We focus on customers in the R&D, validation, and small-batch prototyping stages — research institutions with limited budgets and small sample volumes, enterprises with confidential development requirements, and startups exploring and validating critical processes. Flexible single-step services, technical support, testing and analysis, and report delivery help you advance with greater control over cost and lead time.
Our Features
Delivery is not simply the final step of the process; it is our core mission. Drawing on deep process expertise and a strong engineering mindset, we are committed to overcoming technical challenges in both standard foundry projects and demanding R&D prototyping. We make every effort to ensure high-quality project execution with the highest level of professional dedication.
Technology Roadmap
Building a progressive capability path in advanced packaging — from proven interconnect processes to next-generation glass-based and optical integration solutions.
Foundation: Flip-Chip & TSV Interposer Fabrication
Building core capabilities in Flip-chip assembly and TSV interposer manufacturing to support high-density micro-connects and 2.5D/3D advanced packaging solutions.
Expansion: TGV Technology Development
Developing through-glass via technologies, including glass via formation, metallization, and interposer integration, to enable low-loss, high-frequency, and high-performance packaging platforms.
Application: TGV Applications & CPO Integration
Extending TGV-based interposer applications across high-speed, RF, and interposer integration markets, while advancing Co-Packaged Optics (CPO) solutions for next-generation data connectivity and computing systems.
Global Presence
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.