Atomic Force Microscope (AFM)
Atomic force microscopy provides nanoscale surface roughness, profile measurement, and thin-film topography characterization for wafers and substrates. This high-resolution technique enables precise 3D surface analysis, nano-scale feature detection, and thin-film thickness evaluation, supporting advanced process development and quality control in semiconductor and MEMS manufacturing.
Application Scenarios: Surface roughness analysis, nano measurement, thin-film profiling.
Classic Standard: ASTM E2859 / ISO 4287.
Charging Standard: 1,000 RMB per hour.
OVERVIEW
YURAY provides comprehensive atomic force microscopy (AFM) services for nanoscale surface characterization across semiconductor wafers, glass substrates, thin films, and advanced packaging structures. From surface roughness and step-height measurement to nano-defect inspection and thin-film morphology analysis, our AFM platform delivers sub-angstrom vertical resolution and excellent repeatability. We support multiple imaging modes including contact, tapping, and non-contact, with automated wafer mapping for production-level characterization.
SERVICES
Our AFM platform enables high-resolution 3D surface imaging and quantitative nanometrology — supporting R&D characterization, process monitoring, and quality assurance across a wide range of materials and device structures.
Surface Roughness Analysis
Quantitative surface roughness measurement including Ra, Rq (RMS), Rz, and Rmax parameters over multiple scan sizes — enabling precise characterization of ultra-smooth surfaces for epi-ready wafers, thin films, and polished substrates.
| Parameter | Specification |
|---|---|
| Vertical Resolution | ≤ 0.1 nm |
| Lateral Resolution | ≤ 1 nm |
| Scan Sizes | 1×1 μm – 100×100 μm |
| Roughness Parameters | Ra, Rq, Rz, Rmax, Rv, Rp |
| Measurement Modes | Contact / Tapping / Non-contact |
| Sample Types | Si, glass, thin films, metals |
| Wafer Size | 4 / 6 / 8 / 12 inch |
Step-Height & Film Thickness
Precise step-height and thin-film thickness measurement using AFM profilometry — ideal for characterizing patterned structures, etched features, deposited films, and CMP planarization performance with nanometer-level accuracy.
| Parameter | Specification |
|---|---|
| Step Height Range | 1 nm – 100 μm |
| Step Height Accuracy | ≤ 1% of step height |
| Film Thickness | Sub-nm to multi-μm |
| Lateral Feature Size | ≥ 10 nm |
| Profile Length | Up to 100 μm |
| Measurement Modes | Contact / Tapping mode |
| Sample Types | Patterned wafers, thin films |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven AFM characterization results.
Ultra-Smooth Wafer Surface Characterization
- AFM tapping-mode measurement at 5 points
- Sample Supply — 8-inch CMP polished silicon wafer, incoming inspection and sample preparation
- Multi-scale roughness analysis
- Center + 4 cardinal points mapping
- Analysis — Comprehensive roughness parameter extraction
- Metrology — 3x repeat measurement at each site
- 8-inch wafer supported
- Ra: 0.12 nm average
- Both scan sizes completed
- 5-point roughness map delivered
- Rq, Rz, Rmax all reported
- Repeatability: < 0.02 nm
- Images, data, and analysis consolidated
- Final characterization report delivered
Thin-Film Step-Height Measurement on Glass
- AFM contact-mode step-height measurement
- Sample Supply — 6-inch glass with patterned AlOₓ film, incoming inspection and sample identification
- 9-point step-height mapping across sample
- Tapping-mode roughness on film surface
- Analysis — Line scan profile and edge analysis
- Metrology — Reference standard calibration check
- 6-inch glass supported
- Thickness: 49.6 nm average
- Uniformity: 2.1% (within wafer)
- Ra: 0.35 nm (film surface)
- Step profile and edge data completed
- Calibration verified within ±1%
- AFM images, profiles, and data integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.