Dicing
YURAY provides precision wafer dicing services including mechanical blade dicing and laser dicing for silicon, glass, and compound semiconductor wafers. With tight street-width capability, low kerf loss, and clean edge quality, our dicing platform supports advanced packaging, MEMS, optoelectronic, and high-volume manufacturing applications.
OVERVIEW
YURAY provides comprehensive wafer dicing solutions covering mechanical blade dicing and laser dicing for silicon, glass, and compound semiconductor substrates. From standard street cutting to narrow-street, thin-wafer, and stealth dicing processes, our platform delivers clean edge quality, low kerf loss, and high die yield across 4- to 12-inch wafers. We support advanced packaging, MEMS, optoelectronic, and high-volume manufacturing with integrated die inspection and end-to-end process flow management.
SERVICES
Our wafer dicing platform combines mechanical blade dicing and laser-based technologies — enabling precise singulation for a wide range of materials, thicknesses, and device requirements with high yield and clean edge quality.
Mechanical Dicing
Precision mechanical blade dicing for silicon and glass wafers, delivering clean singulation with controlled edge chipping and tight die-to-die spacing. Ideal for high-volume manufacturing of standard and advanced packaging devices.
| Parameter | Specification |
|---|---|
| Dicing Thickness | 50 μm – 1.2 mm |
| Street Width | ≥ 20 μm |
| Kerf Loss | ≤ 30 μm |
| Blade Type | Resin / metal bonded blades |
| Edge Chipping | < 30 μm |
| Die Size Range | 200 μm – 50 mm |
| Wafer Size | 4 / 6 / 8 / 12 inch |
CASE STUDY
At YURAY, we provide end-to-end full-chain services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven dicing results.
Glass Wafer Mechanical Dicing for TGV
Thin-Wafer Laser Dicing for 3D IC
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.