Kelvin Resistance Measurement
Kelvin four-point probe measurement provides accurate low-resistance readings for metal traces on wafers, eliminating contact resistance errors.
Application Scenarios: Conductive layer characterization, sheet resistance testing, precision electrical measurement.
Classic Standard: ASTM F374 / SEMI MF43.
Charging Standard: Quoted per sample quantity and test duration. Please contact YURAY for pricing.
OVERVIEW
YURAY provides four-wire Kelvin resistance measurement for accurate characterization of low-resistance interconnect structures. By separating current and sense paths, Kelvin measurement eliminates probe and lead resistance — enabling precise measurement of TSV, via, micro-bump, and RDL resistance across wafers, panels, and packages. Multi-point mapping delivers per-structure resistance, within-die and within-wafer uniformity, and yield statistics with full reporting.
SERVICES
Our Kelvin measurement platform enables precise low-resistance characterization of single structures and interconnect chains — supporting interconnect qualification, yield verification, and reliability monitoring.
Four-Point Kelvin Resistance Measurement
Four-wire Kelvin measurement of TSVs, vias, and micro-bumps for accurate low-resistance characterization — eliminating lead and contact resistance to resolve μΩ-level interconnect resistance.
| Parameter | Specification |
|---|---|
| Measurement Method | 4-wire Kelvin |
| Resistance Range | μΩ – mΩ |
| Measurement Accuracy | ± 0.1% |
| Feature Size | ≥ 1 μm via / bump |
| Probe Force | 1 – 100 g |
| Temperature | RT (optionally RT – 200 °C) |
| Output | Resistance map + statistics |
Interconnect & Daisy-Chain Resistance Mapping
Kelvin resistance mapping of via chains, daisy chains, and interconnect structures for yield and reliability verification — enabling per-structure resistance measurement and open/short detection across high-density networks.
| Parameter | Specification |
|---|---|
| Measurement Method | 4-wire Kelvin chain measurement |
| Structure Types | TSV chain, via chain, daisy chain |
| Resistance Range | Ω – kΩ (chain) |
| Measurement Accuracy | ± 0.1% |
| Channel Count | Up to 1,000 channels |
| Sample Types | Wafers, panels, packages |
| Output | Per-structure resistance |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven Kelvin measurement results.
TSV Kelvin Resistance Qualification
- Multi-point Kelvin probing
- Sample Supply — Incoming inspection and die selection
- Test Setup — Probe calibration
- Result — Statistical summary
- Uniformity — Resistance mapping
- Evaluation — Rating and documentation
- 12-inch wafer supported
- Calibration verified
- Resistance data captured
- Mean: 32 mΩ measured
- Uniformity: 4.2%
- PASS — within acceptance criteria
- Maps and data integrated
- Final characterization report delivered
Micro-Bump Contact Resistance Measurement Program
- Multi-point probing
- Sample Supply — Incoming inspection and die selection
- Test Setup — Probe calibration
- Result — Statistical summary
- Analysis — Resistance mapping
- Evaluation — Rating and documentation
- Wafer supported
- Calibration verified
- Resistance data captured
- Mean: 6.1 mΩ measured
- Uniformity within specification
- PASS — within acceptance criteria
- Data and images integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.