YURAY TECH Expands Metrology Lab with New AFM and SEM Capabilities

YURAY TECH has upgraded its in-house metrology laboratory with newly installed atomic force microscopy (AFM) and scanning electron microscopy (SEM) systems to support sub-nanometer surface characterization for advanced packaging and semiconductor substrate development. Semiconductor packaging and interposer manufacturing require ultra-precise inspection of surface topography, via profiles, thin film layers, and fine-pitch interconnect structures. Sub-nanometer level measurement is critical to validate process quality, detect micro-defects, and ensure consistent performance of glass interposers, RDL layers and TGV structures. The new SEM delivers high-resolution imaging for cross-section analysis and feature measurement of microscale and nanoscale structures. The AFM system enables non-contact surface roughness mapping and 3D surface profiling without damaging delicate samples. Both tools are fully integrated into YURAY’s process development workflow. The expanded metrology lab strengthens YURAY’s internal capability for material research, process qualification, and customer sample verification. Customers can leverage the lab’s characterization services during prototype development, accelerating the iteration cycle for 2.5D interposer and advanced substrate projects.