YURAY Partners with Leading Research Institute on 2.5D Interposer R&D

YURAY TECH is pleased to announce a joint development program focused on fine-pitch RDL and chiplet integration on 12-inch interposer platforms, in partnership with a top domestic semiconductor research institute. 2.5D interposer technology is the backbone of modern chiplet systems. As chiplet counts increase and I/O pitch continues to shrink, 12-inch large-area interposers become necessary to reduce packaging cost and improve integration density. The joint R&D project targets key technical challenges for 12-inch interposer manufacturing, including ultra-fine pitch redistribution layer (RDL) fabrication, uniform thin film deposition, and multi-chip co-integration. Within this collaboration, the research institute contributes advanced chip design and testing expertise, while YURAY provides glass interposer material platform, substrate processing and metrology capabilities. Both parties will jointly build test vehicles, conduct reliability testing, and optimize process recipes for large panel 2.5D integration. The project aims to validate a manufacturable 12-inch glass interposer solution for high-performance computing and AI chiplet applications. The results of this cooperation will accelerate the industrial adoption of glass interposer technology and support domestic advanced packaging ecosystem development.